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    上海百勁機械有限公司

    Hotline: 13761555111

    equipment-00-01

    Laser cutting machine

    equipment-01-02 equipment-01-01

    Mitsubishi ML3015LUP Laser Cutting Machine from Japan

    Mitsubishi ML3015LUP Motor adopts BEIJNG-FANUC OI-C and BEIJING-FANUC OI MATE-C system, the power of main motor is 4.0kW, the power of the air compressor is 22kW, the power of the water motor is 3.75kW, the power of the sucker hanger is 2.17kW; the total power is 31.92kW. The machine process with liquid oxygen and liquid nitrogen. Various kinds of steel plate ≤20mm and stainless steel & aluMINum plate ≤15mm could be processed. The processing range is 1500*3000mm and the error of the basic size is ≤0.02mm.

     Technical Parameter

    Laser power
    4000W
    Rated size of sheet (L × W)

    3000×1500
    2500×1250
    2000×1000

    Processing range

    X=3000mm
    Y=1500mm
    Z=100mm

    MAX. sheet thickness

    carbon steel plate 20mm
    stainless steel plate 10mm
    aluminium plate 10mm

    Positioning error pa* ±0.1mm
    Positioning scattering degree ps* ±0.06mm
    Gas composition of laser CO2:N2:He=1.7%:23.4%:74.9%

    equipment-01-03 equipment-01-04

    Bystronic BYSPRINT 3015 Laser Processing Machine from Switzerland

    BYSPRINT 3015 Laser Processing Machine from Bystronic in Switzerland is of international advanced level. It adopts modular design system. It can gradually upgrade the system with the increase of processing requirements. The NC programMINg of it abandons the traditional line input method. It can convert the graphics generated by CAD into the mode of systematic acceptance, and can accurately process a variety of complex shape and bore, and complete the cutting process directly in accordance with the graphics.

    Technical Parameter

    Laser power 2200W
    Rated size of sheet (L × W) 3000×1500
    Processing range

    X=3048mm
    Y=1524mm
    Z=70mm

    MAX. sheet thickness

    carbon steel plate 15mm
    stainless steel plate 6mm
    aluminium plate 5mm

    Positioning error pa* ±0.1mm
    Positioning scattering degree ps* ±0.05mm

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